In high-end flexible packaging, the performance of the metallized layer largely depends on the quality of the BOPP substrate. During vacuum metallization, aluminum atoms need to form a uniform and firmly bonded layer on the film surface. If the base film has insufficient surface energy, uneven thickness, or poor flatness, problems such as weak aluminum adhesion, uneven metallic appearance, and coating defects may occur during further processing.
HUA HENG High Flatness Metallizable BOPP Base Film is specially developed for metallization processes. Through optimized film formulation, precise stretching technology, and controlled surface treatment, the film provides a stable foundation for aluminum deposition and lamination, supporting manufacturers in achieving better barrier performance, visual quality, and production consistency.
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Comparison |
Ordinary BOPP Film |
High Flatness Metallizable BOPP Base Film |
|
Main Purpose |
General packaging and printing applications |
Designed specifically for vacuum metallization processes |
|
Surface Performance |
Standard surface properties |
Optimized surface characteristics for stronger aluminum bonding |
|
Aluminum Adhesion |
May experience weak bonding or coating instability |
Provides reliable aluminum layer adhesion and better coating durability |
|
Film Flatness |
General thickness uniformity |
High flatness supports more consistent aluminum deposition |
|
Metallization Quality |
Higher risk of uneven coating, pinholes, or visual defects |
Creates a smoother and more uniform metallic appearance |
|
Lamination Compatibility |
Suitable for basic applications |
Supports dry lamination and advanced flexible packaging structures |
|
Barrier Performance |
Depends on additional structures |
Stable aluminum layer improves oxygen, moisture, and light barrier properties |
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Production Stability |
May require more process adjustment |
Helps reduce coating defects and improve processing efficiency |
During vacuum metallization, aluminum vapor is deposited onto the BOPP film surface and forms a thin metallic barrier layer. The bonding quality between aluminum and the substrate determines the stability of the final packaging structure.
HUA HENG High Flatness Metallizable BOPP Base Film improves this bonding process through optimized surface characteristics.
The specially designed film surface provides suitable surface energy, allowing aluminum atoms to spread more evenly during deposition. Combined with precise corona treatment, the film achieves better interaction between the BOPP substrate and aluminum coating, reducing problems such as aluminum peeling, transfer, and uneven metallization.
At the same time, the high flatness of the film surface helps maintain consistent coating thickness during high-speed metallization, improving the appearance and barrier performance of the final metallized packaging.
High-quality metallized packaging requires more than a reflective appearance. The stability of the aluminum layer directly affects the protection performance and market value of the final package.
With HUA HENG High Flatness Metallizable BOPP Base Film, packaging manufacturers can achieve:
A stable metallized layer creates an effective barrier against oxygen, moisture, and light, helping protect products that require longer shelf life and better preservation.
It is suitable for packaging applications such as:
● Snack foods
● Coffee and tea
● Pet food
● Pharmaceutical products
● Premium consumer goods
A smooth and uniform substrate helps produce a more consistent metallic finish, improving package brightness and enhancing premium product presentation on retail shelves.
The combination of excellent flatness, surface treatment, and mechanical strength helps reduce processing problems during metallization and lamination, improving production efficiency and reducing material waste.
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Item |
Specification |
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Material |
Biaxially Oriented Polypropylene (BOPP) |
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Application |
Metallizable packaging substrate |
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Structure |
Single Side Corona / Double Side Corona |
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Thickness Range |
12μm – 30μm |
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Surface Tension |
≥38 mN/m |
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Tensile Strength (MD) |
≥120 MPa |
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Tensile Strength (TD) |
≥200 MPa |
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Haze |
≤2.5% |
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Gloss |
≥85% |
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Thickness Tolerance |
Controlled within ±0.5μm |
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Customization |
Thickness, corona treatment, and performance adjustment available |
It is mainly used as a substrate for vacuum metallized flexible packaging. It is widely applied in food packaging, pharmaceutical packaging, industrial barrier films, and other applications requiring aluminum coating.
Ordinary BOPP film is mainly designed for printing and general packaging. Metallizable BOPP base film requires specially controlled surface properties and flatness to ensure stable aluminum adhesion and uniform coating during vacuum metallization.
HUA HENG improves aluminum adhesion through optimized film formulation, precise surface treatment, and controlled manufacturing processes, providing better bonding conditions between the BOPP substrate and aluminum layer.
Yes. When combined with aluminum metallization and other packaging layers, the film can help create high-barrier structures for food products requiring protection from oxygen, moisture, and light.
Yes. HUA HENG can adjust film thickness, surface treatment, and other technical parameters according to customers’ metallizing equipment, lamination process, and final packaging requirements.
The standard MOQ is 20,000 kg. Specific order requirements can be discussed according to film specifications and application needs.
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